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商品明細
IBond5000-Manual Dual Ball & Wedge Wire Bonder
商品詳細介紹Product Introduction
| IBond5000-Dual基本規格 |
| 外觀尺寸 (Dimensions) | 680mm(W)x700mm(D)x530mm(H) |
| 打線區域 (Bonding area) | 135mmx135mm (5.3"x5.3") |
| 供線角度 (Feed angle) | 30/45/90 degrees |
| 深腔模式 (Deep access) | 選配 |
| 適用線材線徑 (Wire diameter) | Gold wire: 17~75μm (0.7~3mil) Cu wire: 17~50μm (0.7~2mil) Al wire: 20~75μm (0.8~3mil) Gold ribbon: 25x250μm (1x10 mil) |
| 線軸尺寸 (Spool size) | Ball: 2"x1" double flange spool Wedge: 2"x1" double flange spool 1/2" spool (type TS-1) 2"x 1" spool holder for ribbon |
| 超音波功率 (Ultrasonic power) | 1.3/3.0 watts |
| 鍵合力 (Bonding force) | 10~250 grams |
| 溫度控制 (Temperature controller) | 250℃±5℃ |
| 人機介面 (UI) | 7" TFT Touch Screen Management |
| 軟體系統 (Software) | Windows CE |
| 電控系統 (Control system) | Cortex A9 Dual Core CPU based |
| 打線參數儲存 (Bonding profiles storage) | 可儲存於USB隨身碟 |
| 打線參數庫 (Bonding profiles library) | MPP Bonding profiles internal library |
| 電源 (Power) | 100~240V, 50/60Hz |
商品備註說明Product Remark
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